DFT   2004 IEEE International Symposium on Defect and Fault-Tolerance in VLSI Systems
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Defect Avoidance in a 3-D Heterogeneous Sensor
A 3D Heterogeneous Sensor using a stacked chip is investigated. Optical Active Pixel Sensor and IR Bolometer detectors are combined to create a multispectral pixel for aligned col...
Glenn H. Chapman, Vijay K. Jain, Shekhar Bhansali
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