Sciweavers

ICCAD
1996
IEEE

A general dispersive multiconductor transmission line model for interconnect simulation in SPICE

13 years 7 months ago
A general dispersive multiconductor transmission line model for interconnect simulation in SPICE
Although numerous methods have been proposed for interconnect simulation, no single model exists for all kind of transmission line problems. This paper presents a new, single, general dispersive coupled uniform/nonuniform transmission line model which can be used for interconnect simulation in SPICE. The mathematical model is based on the use of Chebyshev polynomials for the representation of the spatial variation of the transmission-line voltages and currents. A simple collocation procedure is used to obtain a matrix representation of the transmission line equations with matrix coecients that are rst polynomials in s, and in which terminal transmission-line voltages and currents appear explicitly. Thus, the model is compatible with both the SPICE's numerical integration algorithm and the modi ed nodal analysis formalism.
Mustafa Celik, Andreas C. Cangellaris
Added 07 Aug 2010
Updated 07 Aug 2010
Type Conference
Year 1996
Where ICCAD
Authors Mustafa Celik, Andreas C. Cangellaris
Comments (0)