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VLSID
2010
IEEE

Processor Architecture Design Using 3D Integration Technology

13 years 1 months ago
Processor Architecture Design Using 3D Integration Technology
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, is one of the promising solutions to mitigate the interconnect problem in modern microprocessor designs. 3D memory stacking also enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the “memory wall” problem. In addition, heterogenous integration enabled by 3D technology can also result in innovation designs for future microprocessors. This paper serves as a survey of various approaches to design future 3D microprocessors, leveraging the benefits of fast latency, higher bandwidth, and heterogeneous integration capability that are offered by 3D technology. 1
Yuan Xie
Added 31 Jan 2011
Updated 31 Jan 2011
Type Journal
Year 2010
Where VLSID
Authors Yuan Xie
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