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CORR
2008
Springer

0-level Vacuum Packaging RT Process for MEMS Resonators

8 years 10 months ago
0-level Vacuum Packaging RT Process for MEMS Resonators
A new Room Temperature (RT) 0-level vacuum package is demonstrated in this work, using amorphous silicon (aSi) as sacrificial layer and SiO2 as structural layer. The process is compatible with most of MEMS resonators and Resonant Suspended-Gate MOSFET [1] fabrication processes. This paper presents a study on the influence of releasing hole dimensions on the releasing time and hole clogging. It discusses mass production compatibility in terms of packaging stress during back-end plastic injection process. The packaging is done at room temperature making it fully compatible with IC-processed wafers and avoiding any subsequent degradation of the active devices.
Nicolas Abelé, D. Grogg, C. Hibert, F. Cass
Added 09 Dec 2010
Updated 09 Dec 2010
Type Journal
Year 2008
Where CORR
Authors Nicolas Abelé, D. Grogg, C. Hibert, F. Casset, Pascal Ancey, Adrian M. Ionescu
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