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2011
ACM

Assembling 2D blocks into 3D chips

10 years 4 months ago
Assembling 2D blocks into 3D chips
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been slow. In addition to technology-related difficulties, industry experts cite the lack of a commercial 3D EDA tool-chain and design standards, high risk associated with a new technology, and high cost of transition from 2D to 3D ICs. To streamline the transition, we explore design styles that reuse existing 2D Intellectual Property (IP) blocks. Currently, these design styles severely limit the placement of Through-Silicon Vias (TSVs) and constrain the reuse of existing 2D IP blocks in 3D ICs. To overcome this problem, we develop a methodology for using TSV islands and novel techniques for clustering nets to connect 2D IP blocks through TSV islands. Our empirical validation demonstrates 3D integration of traditional 2D circuit blocks without modifying their layout for this context. Categories and Subject Descrip...
Johann Knechtel, Igor L. Markov, Jens Lienig
Added 15 Sep 2011
Updated 15 Sep 2011
Type Journal
Year 2011
Where ISPD
Authors Johann Knechtel, Igor L. Markov, Jens Lienig
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