Sciweavers

Share
DAC
2004
ACM

Compact thermal modeling for temperature-aware design

10 years 3 months ago
Compact thermal modeling for temperature-aware design
Thermal design in sub-100nm technologies is one of the major challenges to the CAD community. In this paper, we first introduce the idea of temperature-aware design. We then propose a compact thermal model which can be integrated with modern CAD tools to achieve a temperature-aware design methodology. Finally, we use the compact thermal model in a case study of microprocessor design to show the importance of using temperature as a guideline for the design. Results from our thermal model show that a temperature-aware design approach can provide more accurate estimations, and therefore better decisions and faster design convergence. Categories and Subject Descriptors: B.7.2 [Hardware]: Design Aids J.6 [Computer-Aided Engineering]: Computer-Aided Design. General Terms: Design, Algorithms.
Wei Huang, Mircea R. Stan, Kevin Skadron, Karthik
Added 13 Nov 2009
Updated 13 Nov 2009
Type Conference
Year 2004
Where DAC
Authors Wei Huang, Mircea R. Stan, Kevin Skadron, Karthik Sankaranarayanan, Shougata Ghosh, Sivakumar Velusamy
Comments (0)
books