Encoding-Based Minimization of Inductive Cross-Talk for Off-Chip Data Transmission

Inductive cross-talk within IC packaging is becoming a significant bottleneck in high-speed inter-chip communication. The parasitic inductance within IC packaging causes bounce on the power supply pins in addition to glitches and rise-time degradation on the signal pins. Until recently, the parasitic inductance problem was addressed by aggressive package design. In this work we present a technique to encode the off-chip data transmission to limit bounce on the supplies and reduce inductive signal coupling due to transitions on neighboring signal lines. Both these performance limiting factors are modeled in a common mathematical framework. Our experimental results show that the proposed encoding based techniques result in reduced supply bounce and signal degradation due to inductive cross-talk, closely matching the theoretical predictions. We demonstrate that the overall bandwidth of a bus actually increases by 85% using our technique, even after accounting for the encoding overhead. ...

• Type: Conference
• Year: 2005
• Where: DATE
• Authors: Brock J. LaMeres, Sunil P. Khatri
• Keywords: DATE 2005, Hardware, IC Packaging, Inductive Cross-talk, Parasitic Inductance