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SOCC
2008
IEEE

Failure analysis for ultra low power nano-CMOS SRAM under process variations

13 years 10 months ago
Failure analysis for ultra low power nano-CMOS SRAM under process variations
— Several design metrics have been used in the past to evaluate the SRAM cell stability. However, most of them fail to provide the exact stability figures as shown in this paper. Therefore, we investigate new stability metrics and report the stability analysis for typical a SRAM cell. In particular, a concept called power metric is introduced. From this metric we derive two new stability figures; static power noise margin (ËÈÆÅ) and write trip power (ÏÌÈ). It is shown that these new figures provide better cell stability analysis. Furthermore, we have exhaustively analyzed the impact of different parameters variations such as cell ratio, supply voltage Î and threshold voltage ÎØ on ËÈÆÅ and ÏÌÈ. Statistical models for estimating ËÈÆÅ and ÏÌÈ from intra-die ÎØ variations are presented. The estimated results match well with the Monte Carlo (MC) simulations.
Jawar Singh, Jimson Mathew, Dhiraj K. Pradhan, Sar
Added 01 Jun 2010
Updated 01 Jun 2010
Type Conference
Year 2008
Where SOCC
Authors Jawar Singh, Jimson Mathew, Dhiraj K. Pradhan, Saraju P. Mohanty
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