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CORR
2008
Springer

Interconnect Challenges in Highly Integrated MEMS/ASIC Subsystems

8 years 2 months ago
Interconnect Challenges in Highly Integrated MEMS/ASIC Subsystems
Micromechanical devices like accelerometers or rotation sensors form an increasing segment beneath the devices supplying the consumer market. A hybrid integration approach to build smart sensor clusters for the precise detection of movements in all spatial dimensions requires a large toolbox of interconnect technologies, each with its own constraints regarding the total process integration. Specific challenges described in this paper are post-CMOS feedthroughs, front-to-front die contact arrays, vacuum-compliant lateral interconnect and finepitch solder balling to finally form a Chip-Scale Systemin-Package (CSSiP).
N. Marenco, S. Warnat, W. Reinert
Added 25 Dec 2010
Updated 25 Dec 2010
Type Journal
Year 2008
Where CORR
Authors N. Marenco, S. Warnat, W. Reinert
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