Interconnect Challenges in Highly Integrated MEMS/ASIC Subsystems

Micromechanical devices like accelerometers or rotation sensors form an increasing segment beneath the devices supplying the consumer market. A hybrid integration approach to build smart sensor clusters for the precise detection of movements in all spatial dimensions requires a large toolbox of interconnect technologies, each with its own constraints regarding the total process integration. Specific challenges described in this paper are post-CMOS feedthroughs, front-to-front die contact arrays, vacuum-compliant lateral interconnect and finepitch solder balling to finally form a Chip-Scale Systemin-Package (CSSiP).

• Type: Journal
• Year: 2008
• Where: CORR
• Authors: N. Marenco, S. Warnat, W. Reinert
• Keywords: CORR 2008, Education, Smart Sensor Clusters, Total Process Integration, Vacuum-compliant Lateral Interconnect