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ICCAD
2006
IEEE

Layer minimization of escape routing in area array packaging

14 years 1 months ago
Layer minimization of escape routing in area array packaging
We devise a central triangular sequence to minimize the escape routing layers in area array packaging. We use a network flow model to analyze the bottleneck of the routable pins. The triangular patterns are generated in a reverse order from the last to the first layer. We demonstrate that the triangular pin sequence maximizes the sum of escape pins in the accumulated layers and thus minimize the number of escape routing layers. A test case is presented to illustrate the approach. Keywords Escape routing, bottleneck analysis, central triangular pattern.
Renshen Wang, Rui Shi, Chung-Kuan Cheng
Added 16 Mar 2010
Updated 16 Mar 2010
Type Conference
Year 2006
Where ICCAD
Authors Renshen Wang, Rui Shi, Chung-Kuan Cheng
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