Megasonic Enhanced Electrodeposition

A novel way of filling high aspect ratio vertical interconnection (microvias) is presented. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst-diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. Higher throughput and better control over the deposition properties are therefore possible for the manufacturing of interconnections and metal-based MEMS.

• Type: Journal
• Year: 2008
• Where: CORR
• Authors: Jens Georg Kaufmann, Marc P. Y. Desmulliez, D. Price
• Keywords: Conformal Electrodeposition, CORR 2008, Education, Megasonic Frequencies, Ratio Vertical Interconnection