Microassembly of 3-D MEMS structures utilizing a MEMS microgripper with a robotic manipulator

This paper describes the process of bonding a MEMS (Micro-ElectroMechanical System) microgripper to the distal end of a robotic manipulator arm using a molten solder bonding technique. This task is part of ongoing work which involves the development of a general microassembly workstation. The goal of this workstation is to construct 3-D microstructures from MEMS subcomponents. The microgrippers bonded using the method

• Type: Conference
• Year: 2003
• Where: ICRA
• Authors: Nikolai Dechev, William L. Cleghorn, James K. Mills
• Keywords: General Microassembly Workstation, ICRA 2003, Robotic Manipulator Arm, Robotics, Solder Bonding Technique