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ICRA
2003
IEEE

Microassembly of 3-D MEMS structures utilizing a MEMS microgripper with a robotic manipulator

9 years 11 months ago
Microassembly of 3-D MEMS structures utilizing a MEMS microgripper with a robotic manipulator
This paper describes the process of bonding a MEMS (Micro-ElectroMechanical System) microgripper to the distal end of a robotic manipulator arm using a molten solder bonding technique. This task is part of ongoing work which involves the development of a general microassembly workstation. The goal of this workstation is to construct 3-D microstructures from MEMS subcomponents. The microgrippers bonded using the method
Nikolai Dechev, William L. Cleghorn, James K. Mill
Added 04 Jul 2010
Updated 04 Jul 2010
Type Conference
Year 2003
Where ICRA
Authors Nikolai Dechev, William L. Cleghorn, James K. Mills
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