Sciweavers

Share
MR
2010

Modeling of board-level package by Finite Element Analysis and laser interferometer measurements

9 years 7 months ago
Modeling of board-level package by Finite Element Analysis and laser interferometer measurements
Bo Zhang, PinKuan Liu, Han Ding, Wenwu Cao
Added 29 Jan 2011
Updated 29 Jan 2011
Type Journal
Year 2010
Where MR
Authors Bo Zhang, PinKuan Liu, Han Ding, Wenwu Cao
Comments (0)
books