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ICCAD
2009
IEEE

Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs

9 years 1 months ago
Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-vias (TTSVs) and micro-fluidic channel (MFC) based liquid cooling. In case of power delivery, a highly complex power distribution network is required to deliver currents reliably to all parts of the 3D stacked IC while suppressing the power supply noise to an acceptable level. However, these thermal and power networks pose major challenges in signal routability and congestion. This is because the signal, power, and thermal interconnects are all competing for routing space. In this paper, we present a co-optimization methodology for the signal, power, and thermal interconnects for 3D stacked ICs based on design of experiments (DOE) and response surface method (RSM). The goal is to improve performance, thermal, noise, and congestion metrics with our holistic approach. We also provide in-depth comparison between...
Young-Joon Lee, Rohan Goel, Sung Kyu Lim
Added 18 Feb 2011
Updated 18 Feb 2011
Type Journal
Year 2009
Where ICCAD
Authors Young-Joon Lee, Rohan Goel, Sung Kyu Lim
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