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1998

The Offset Cube: A Three-Dimensional Multicomputer Network Topology Using Through-Wafer Optics

8 years 11 months ago
The Offset Cube: A Three-Dimensional Multicomputer Network Topology Using Through-Wafer Optics
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconnect has been proposed as a useful technology for building ultra-compact MPPs since it provides a simplified mechanism for interconnecting stacked multichip substrates. This paper presents the offset cube, a new network topology designed to exploit the packaging benefits of through-wafer optical interconnect in ultra-compact MPP systems. We validate the offset cube’s topological efficiency by developing deadlock-free adaptive routing protocols with modest virtual channel requirements (only two virtual channels per link needed for full adaptivity). A preliminary analysis of router complexity suggests these protocols can be efficiently implemented in hardware. We also present a 3D mesh embedding for the offset cube. Network simulations show the offset cube performs comparably to a bidirectional 3D mesh of equa...
W. Stephen Lacy, José Cruz-Rivera, D. Scott
Added 23 Dec 2010
Updated 23 Dec 2010
Type Journal
Year 1998
Where TPDS
Authors W. Stephen Lacy, José Cruz-Rivera, D. Scott Wills
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