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ET
2006

Optimization of Test/Diagnosis/Rework Location(s) and Characteristics in Electronic System Assembly

13 years 3 months ago
Optimization of Test/Diagnosis/Rework Location(s) and Characteristics in Electronic System Assembly
In this paper, an optimization methodology is used to select the locations and characteristics of test, diagnosis and rework operations in electronic systems assembly processes. Real-coded genetic algorithms are used to perform a multi-variable optimization that minimizes the yielded cost of products resulting from an assembly process that includes test/diagnosis/rework operations characterized by costs, yields fault coverage, and rework attempts. A general complex process flow is analyzed using the algorithms proposed in this paper, and a multichip module assembly process flow is used to demonstrate that the methodology can identify optimum test and rework solutions that result in a reduction in yielded cost.
Zhen Shi, Peter Sandborn
Added 12 Dec 2010
Updated 12 Dec 2010
Type Journal
Year 2006
Where ET
Authors Zhen Shi, Peter Sandborn
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