Sciweavers

Share
ISPD
2003
ACM

Partition-driven standard cell thermal placement

9 years 9 months ago
Partition-driven standard cell thermal placement
The thermal problem has been emerged as one of the key issues for next-generation IC design. In this paper, we propose a scheme to achieve better thermal distribution for partitiondriven standard cell placement. The proposed heuristic uses a multigrid-like method that simplifies the thermal equation at each level of partitioning and makes it possible to incorporate temperature considerations directly as placement constraints, thus leading to better thermal distribution. Our experimental results verify the effectiveness of our scheme. We also describe an algorithm to derive a compact thermal model with a complexity of O(mn + m2 ), where m is the number of the mesh nodes on the substrate surface and n is the number of all internal mesh nodes. Categories and Subject Descriptors B.7.2 [Integrated Circuits]: Design Aids—Placement and routing; J.6 [Computer-aided Engineering]: Computeraided design General Terms Algorithms, Design, Experimentation Keywords VLSI, standard cell, partition,...
Guoqiang Chen, Sachin S. Sapatnekar
Added 05 Jul 2010
Updated 05 Jul 2010
Type Conference
Year 2003
Where ISPD
Authors Guoqiang Chen, Sachin S. Sapatnekar
Comments (0)
books