Peak temperature control and leakage reduction during binding in high level synthesis

Temperature is becoming a first rate design criterion in ASICs due to its negative impact on leakage power, reliability, performance, and packaging cost. Incorporating awareness of such lower level physical phenomenon in high level synthesis algorithms will help to achieve better designs. In this work, we developed a temperature aware binding algorithm. Switching power of a module correlates with its operating temperature. The goal of our binding algorithm is to distribute the activity evenly across functional units. This approach avoids steep temperature differences between modules on a chip, hence, the occurrence of hot spots. Starting with a switching optimal binding solution, our algorithm iteratively minimizes the maximum temperature reached by the hottest functional unit. Our algorithm does not change the number of resources used in the original binding. We have used HotSpot, a temperature modeling tool, to simulate temperature of a number ASIC designs. Our binding algorithm red...

• Type: Conference
• Year: 2005
• Where: ISLPED
• Authors: Rajarshi Mukherjee, Seda Ogrenci Memik, Gokhan Memik
• Keywords: Algorithm Reduces Temperature, Binding Algorithm, ISLPED 2005, Temperature Aware Binding