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DSD
2009
IEEE

On the Risk of Fault Coupling over the Chip Substrate

13 years 6 months ago
On the Risk of Fault Coupling over the Chip Substrate
—Duplication and comparison has proven to be an efficient method for error detection. Based on this generic principle dual core processor architectures with output comparison are being proposed for safety critical applications. Placing two instances of the same (arbitrary) processor on one die yields a very cost efficient “single chip” implementation of this principle. At the same time, however, the physical coupling of the two replica creates the potential for certain types of faults to affect both cores in the same way, such that the mutual checking will fail. The key question here is how this type of coverage leakage relates to other imperfections of the duplication and comparison approach that would also be found using two cores on separate dies (such as coupling over a common power supply or clock). In this paper we analyze several of the relevant physical coupling mechanisms and elaborate a model to decompose the genesis of a common cause fault into several steps. We pres...
Peter Tummeltshammer, Andreas Steininger
Added 04 Sep 2010
Updated 04 Sep 2010
Type Conference
Year 2009
Where DSD
Authors Peter Tummeltshammer, Andreas Steininger
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