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ICCAD
2009
IEEE

A study of Through-Silicon-Via impact on the 3D stacked IC layout

9 years 1 months ago
A study of Through-Silicon-Via impact on the 3D stacked IC layout
Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim
Added 18 Feb 2011
Updated 18 Feb 2011
Type Journal
Year 2009
Where ICCAD
Authors Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim
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