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GLVLSI
2005
IEEE

Thermal aware cell-based full-chip electromigration reliability analysis

9 years 8 months ago
Thermal aware cell-based full-chip electromigration reliability analysis
A hierarchical scheme with cells and modules is crucial for managing design complexity during a large integrated circuit design. We present a methodology for thermal aware cell-based electromigration analysis suitable for integrating electromigration reliability analysis into a conventional IC design flow. A block or cell is characterized for reliability while it is characterized for power and timing. Reusing cell characterization data significantly reduces computational load while analyzing a full-chip layout. During full-chip analysis, we compute a layout-level temperature profile from cell power dissipations using a Fast Fourier Transform based algorithm. The described full-chip reliability assessment methodology has been implemented in an interconnect reliability CAD tool. We have exercised the tool to demonstrate performance-reliability tradeoff and the significance of thermalaware reliability analysis for true reliability aware design. Categories and Subject Descriptors B.7.0 [I...
Syed M. Alam, Donald E. Troxel, Carl V. Thompson
Added 24 Jun 2010
Updated 24 Jun 2010
Type Conference
Year 2005
Where GLVLSI
Authors Syed M. Alam, Donald E. Troxel, Carl V. Thompson
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