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CORR
2008
Springer

A Two-Step Etching Method to Fabricate Nanopores in Silicon

10 years 3 months ago
A Two-Step Etching Method to Fabricate Nanopores in Silicon
A cost effectively method to fabricate nanopores in silicon by only using the conventional wet-etching technique is developed in this research. The main concept of the proposed method is a two-step etching process, including a premier double-sided wet etching and a succeeding track-etching. A special fixture is designed to hold the pre-etched silicon wafer inside it such that the track-etching can be effectively carried out. An electrochemical system is employed to detect and record the ion diffusion current once the pre-etched cavities are etched into a through nanopore. Experimental results indicate that the proposed method can cost effectively fabricate nanopores in silicon.
G.-J. Wang, W.-Z. Chen, K. J. Chang
Added 25 Dec 2010
Updated 25 Dec 2010
Type Journal
Year 2008
Where CORR
Authors G.-J. Wang, W.-Z. Chen, K. J. Chang
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