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3DIC
2009
IEEE
13 years 10 months ago
2009
IEEE
- In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrica...
3DIC
2009
IEEE
13 years 10 months ago
2009
IEEE
This paper investigates the effect of the TSV resistance (RTSV) on the performance of boost converters for Solid State Drive (SSD) using circuit simulation. When RTSV is 0Ω, both ...
3DIC
2009
IEEE
13 years 8 months ago
2009
IEEE
Abstract— Networks-on-chip (NoC) is emerging as a key onchip communication architecture for multiprocessor systemson-chip (MPSoC). In traditional electronic NoCs, high bandwidth ...