3 search results - page 1 / 1 » A Comprehensive Layout Methodology and Layout-Specific Circu... |
ISQED
2002
IEEE
13 years 9 months ago
2002
IEEE
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
CHES
2005
Springer
13 years 10 months ago
2005
Springer
Electromagnetic analysis (EMA) can be used to compromise secret information by analysing the electric and/or magnetic fields emanating from a device. It follows differential power...
ASPDAC
2008
ACM
13 years 6 months ago
2008
ACM
Accurate modeling of delay, power, and area of interconnections early in the design phase is crucial for effective system-level optimization. Models presently used in system-level...