28 search results - page 1 / 6 » A Thermal Management and Profiling Method for Reconfigurable... |
FPL
2006
Springer
13 years 8 months ago
2006
Springer
Given large circuit sizes, high clock frequencies, and possibly extreme operating environments, Field Programmable Gate Arrays (FPGAs) are capable of heating beyond their designed...
ISCAS
2006
IEEE
13 years 10 months ago
2006
IEEE
– Increasing logic densities and clock frequencies on FPGAs lead to rapid increase in power density, which translates to higher on-chip temperature. In this paper, we investigate...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
Temperature monitoring using thermal sensors is an essential tool for evaluating the thermal behavior and sustaining the reliable operation in high-performance and high-power syst...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
As CMOS technology scales into the nanometer regime, power dissipation and associated thermal concerns in high-performance ICs due to on-chip hot-spots and thermal gradients are b...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
—Dynamic Thermal Management techniques have been widely accepted as a thermal solution for their low cost and simplicity. The techniques have been used to manage the heat dissipa...