23 search results - page 2 / 5 » A power and temperature aware DRAM architecture |
MICRO
2009
IEEE
13 years 11 months ago
2009
IEEE
Dynamic Random Access Memory (DRAM) is used as the bulk of the main memory in most computing systems and its energy and power consumption has become a first-class design considera...
DSD
2009
IEEE
13 years 11 months ago
2009
IEEE
— 3D stacked architectures provide significant benefits in performance, footprint and yield. However, vertical stacking increases the thermal resistances, and exacerbates tempe...
VLSID
2008
IEEE
14 years 4 months ago
2008
IEEE
Continuous technology scaling has resulted in an increase in both, the power density as well as the variation in device dimensions (process variations) of the manufactured process...
CASES
2006
ACM
13 years 10 months ago
2006
ACM
We propose an architecture that uses NAND flash memory to reduce main memory power in web server platforms. Our architecture uses a two level file buffer cache composed of a re...
ISCA
2003
IEEE
13 years 9 months ago
2003
IEEE
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...