12 search results - page 2 / 3 » ASPDAC 2012 |
ASPDAC
2012
ACM
12 years 1 months ago
2012
ACM
— In this paper, we present an obstacle-aware clock tree synthesis method for through-silicon-via (TSV)-based 3D ICs. A unique aspect of this problem lies in the fact that variou...
ASPDAC
2012
ACM
12 years 1 months ago
2012
ACM
In this paper, we examine the integration potential and explore the design space of low power thermal reliable on-chip interconnect synthesis featuring nanophotonics Wavelength Di...
ASPDAC
2012
ACM
12 years 1 months ago
2012
ACM
— Since re-designing and re-optimizing existing logic, memory, and IP blocks in a 3D fashion significantly increases design cost, nearterm three-dimensional integrated circuit (...
ASPDAC
2012
ACM
12 years 1 months ago
2012
ACM
Behavioral synthesis tools have made significant progress in compiling high-level programs into register-transfer level (RTL) specifications. But manually rewriting code is still ...
ASPDAC
2012
ACM
12 years 1 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...