13 search results - page 1 / 3 » Accurate Thermal Analysis Considering Nonlinear Thermal Cond... |
ISQED
2006
IEEE
13 years 10 months ago
2006
IEEE
The increase in packing density has led to a higher power density in the chip which in turn has led to an increase in temperature on the chip. Temperature affects reliability, per...
ISLPED
2006
ACM
13 years 10 months ago
2006
ACM
All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...
DATE
2010
IEEE
13 years 9 months ago
2010
IEEE
—Temperature has a strong influence on integrated circuit (IC) performance, power consumption, and reliability. However, accurate thermal analysis can impose high computation co...
ASPDAC
2006
ACM
13 years 10 months ago
2006
ACM
: With technology scaling, elevated temperatures caused by increased power density create a critical bottleneck modulating the circuit operation. With the advent of FinFET technolo...
DATE
2006
IEEE
13 years 10 months ago
2006
IEEE
This paper derives the multi-layer heat conduction Green’s function, by integrating the eigen-expansion technique and the classic transmission line theories, and presents a loga...