13 search results - page 2 / 3 » Accurate Thermal Analysis Considering Nonlinear Thermal Cond... |
CODES
2007
IEEE
13 years 10 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
3DIC
2009
IEEE
13 years 11 months ago
2009
IEEE
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
DAC
2011
ACM
12 years 4 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
DAGSTUHL
1994
13 years 5 months ago
1994
In this article, we present how it is possible to recover physical parameters of objects such as reflectivity, emissivity and thermal inertia from the analysis of infrared images ...
IJBC
2007
13 years 4 months ago
2007
The parameter dependence of the various attractive solutions of the three variable nonlinear Lorenz model equations for thermal convection in Rayleigh-B´enard flow is studied. I...