80 search results - page 15 / 16 » Algorithms for a switch module routing problem |
DATE
2006
IEEE
14 years 1 days ago
2006
IEEE
The existence of non-uniform thermal gradients on the substrate in high performance IC’s can significantly impact the performance of global on-chip interconnects. This issue is...
EURONGI
2008
Springer
13 years 7 months ago
2008
Springer
DED ABSTRACT The increased popularity and the growth in the number of deployed IEEE 802.11 Access Points (APs) have raised the opportunity to merge together various disjointed wire...
ICPP
2007
IEEE
14 years 9 days ago
2007
IEEE
Three-dimensional Network-on-Chip (3-D NoC) is an emerging research topic exploring the network architecture of 3-D ICs that stack several smaller wafers for reducing wire length ...
SIGCOMM
2010
ACM
13 years 6 months ago
2010
ACM
Data center networks encode locality and topology information into their server and switch addresses for performance and routing purposes. For this reason, the traditional address...
ICCAD
2006
IEEE
14 years 2 months ago
2006
IEEE
In order to handle device matching in analog circuits, some pairs of modules are required to be placed symmetrically. This paper addresses this device-level placement problem for ...