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» Architecting Microprocessor Components in 3D Design Space
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ICCAD
2008
IEEE
105views Hardware» more  ICCAD 2008»
14 years 2 months ago
Parameterized transient thermal behavioral modeling for chip multiprocessors
In this paper, we propose a new architecture-level parameterized transient thermal behavioral modeling algorithm for emerging thermal related design and optimization problems for ...
Duo Li, Sheldon X.-D. Tan, Eduardo H. Pacheco, Mur...
IWVF
2001
Springer
13 years 9 months ago
Volume and Surface Area Distributions of Cracks in Concrete
Volumetric images of small mortar samples under load are acquired by X-ray microtomography. The images are binarized at many different threshold values, and over a million connecte...
George Nagy, Tong Zhang, W. R. Franklin, Eric Land...
SIMPRA
2008
131views more  SIMPRA 2008»
13 years 5 months ago
Distributed simulation of DEVS and Cell-DEVS models in CD++ using Web-Services
: DEVS is a Modeling and Simulation formalism that has been widely used to study the dynamics of discrete event systems. Cell-DEVS is a DEVS-based formalism that defines spatial mo...
Gabriel A. Wainer, Rami Madhoun, Khaldoon Al-Zoubi