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» Architecting Microprocessor Components in 3D Design Space
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ICCAD
2008
IEEE
105views Hardware» more  ICCAD 2008»
14 years 2 months ago
Parameterized transient thermal behavioral modeling for chip multiprocessors
In this paper, we propose a new architecture-level parameterized transient thermal behavioral modeling algorithm for emerging thermal related design and optimization problems for ...
Duo Li, Sheldon X.-D. Tan, Eduardo H. Pacheco, Mur...
IWVF
2001
Springer
13 years 10 months ago
Volume and Surface Area Distributions of Cracks in Concrete
Volumetric images of small mortar samples under load are acquired by X-ray microtomography. The images are binarized at many different threshold values, and over a million connecte...
George Nagy, Tong Zhang, W. R. Franklin, Eric Land...
SIMPRA
2008
131views more  SIMPRA 2008»
13 years 5 months ago
Distributed simulation of DEVS and Cell-DEVS models in CD++ using Web-Services
: DEVS is a Modeling and Simulation formalism that has been widely used to study the dynamics of discrete event systems. Cell-DEVS is a DEVS-based formalism that defines spatial mo...
Gabriel A. Wainer, Rami Madhoun, Khaldoon Al-Zoubi