13 search results - page 1 / 3 » Are carbon nanotubes the future of VLSI interconnections |
ICCAD
2005
IEEE
14 years 1 months ago
2005
IEEE
The work in this paper analyses the applicability of carbon nanotube (CNT) bundles as interconnects for VLSI circuits, while taking into account the practical limitations in this ...
DAC
2006
ACM
14 years 5 months ago
2006
ACM
Increasing resistivity of copper with scaling and rising demands on current density requirements are driving the need to identify new wiring solutions for deep nanometer scale VLS...
ASPDAC
2007
ACM
13 years 8 months ago
2007
ACM
Single-walled carbon nanotube (SWCNT) bundles have the potential to provide an attractive solution for the resistivity and electromigration problems faced by traditional copper int...
ISVLSI
2007
IEEE
13 years 10 months ago
2007
IEEE
As CMOS technology continues to scale, copper interconnect (CuI) will hinder the performance and reliability of Field Programmable Gate Arrays (FPGA) motivating the need for alter...
ASPDAC
2009
ACM
2009
ACM
Reconfigurable double gate carbon nanotube field effect transistor based nanoelectronic architecture
13 years 8 months ago
-- Carbon nanotubes (CNTs) and carbon nanotube field effect transistors (CNFETs) have demonstrated extraordinary properties and are widely accepted as the building blocks of next g...