In chip-multiprocessors (CMPs), the number of cores and the issue width of each core presents an important design trade-off to balance the amount of TLP and ILP between multi-thre...
High-speed serial network interfaces are gaining wide use in connecting multiple processors and peripherals in modern embedded systems, thanks to their size advantage and power ef...
As application complexity increases, modern embedded systems have adopted heterogeneous processing elements to enhance the computing capability or to reduce the power consumption. ...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
- In this paper we analyze the performance, utilization, and power estimation of server systems by both adopting the batch service and adjusting the batch size. In addition to redu...