8 search results - page 1 / 2 » CAD Implications of New Interconnect Technologies |
DAC
2007
ACM
13 years 8 months ago
2007
ACM
This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a repl...
GI
2009
Springer
13 years 8 months ago
2009
Springer
: Future nano scale devices will expose different characteristics than todays silicon devices. While the exponential growth of non recurring expenses (NRE, mostly due to mask sets)...
DAC
2001
ACM
14 years 5 months ago
2001
ACM
This work presents a new and computationally efficient performance optimization technique for distributed RLC interconnects based on a rigorous delay computation scheme. The new o...
TCAD
2002
13 years 3 months ago
2002
This paper introduces an accurate analysis of on-chip inductance effects for distributed interconnects that takes the effect of both the series resistance and the output parasitic ...
ICCAD
2002
IEEE
14 years 1 months ago
2002
IEEE
New electronics technologies are emerging which may carry us beyond the limits of lithographic processing down to molecularscale feature sizes. Devices and interconnects can be ma...