32 search results - page 1 / 7 » CELONCEL: Effective design technique for 3-D monolithic inte... |
ASPDAC
2011
ACM
12 years 8 months ago
2011
ACM
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequent...
MICRO
2008
IEEE
13 years 10 months ago
2008
IEEE
— As semiconductor processing techniques continue to scale down, transient faults, also known as soft errors, are increasingly becoming a reliability threat to high-performance m...
DAC
2007
ACM
14 years 5 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
GLVLSI
2003
IEEE
13 years 9 months ago
2003
IEEE
The current trends in high performance integrated circuits are towards faster and more powerful circuits in the giga-hertz range and even further. As the more complex Integrated C...
MICRO
2009
IEEE
13 years 11 months ago
2009
IEEE
Process variations in integrated circuits have significant impact on their performance, leakage and stability. This is particularly evident in large, regular and dense structures...