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» Circuit simulation based obstacle-aware Steiner routing
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ISPD
2003
ACM
103views Hardware» more  ISPD 2003»
13 years 9 months ago
An integrated floorplanning with an efficient buffer planning algorithm
Previous works on buffer planning are mainly based on fixed die placement. It is necessary to reduce the complexity of computing the feasible buffer insertion sites to integrate t...
Yuchun Ma, Xianlong Hong, Sheqin Dong, Song Chen, ...
ISPD
2007
ACM
151views Hardware» more  ISPD 2007»
13 years 6 months ago
Pattern sensitive placement for manufacturability
When VLSI technology scales toward 45nm, the lithography wavelength stays at 193nm. This large gap results in strong refractive effects in lithography. Consequently, it is a huge...
Shiyan Hu, Jiang Hu
DAC
2003
ACM
14 years 5 months ago
Multilevel floorplanning/placement for large-scale modules using B*-trees
We present in this paper a multilevel floorplanning/placement framework based on the B*-tree representation, called MB*-tree, to handle the floorplanning and packing for large-sca...
Hsun-Cheng Lee, Yao-Wen Chang, Jer-Ming Hsu, Hanna...
FPGA
2003
ACM
167views FPGA» more  FPGA 2003»
13 years 9 months ago
A scalable 2 V, 20 GHz FPGA using SiGe HBT BiCMOS technology
This paper presents a new power saving, high speed FPGA design enhancing a previous SiGe CML FPGA based on the Xilinx 6200 FPGA. The design aims at having a higher performance but...
Jong-Ru Guo, Chao You, Kuan Zhou, Bryan S. Goda, R...
ICCAD
2007
IEEE
111views Hardware» more  ICCAD 2007»
14 years 1 months ago
Exploiting STI stress for performance
— Starting at the 65nm node, stress engineering to improve performance of transistors has been a major industry focus. An intrinsic stress source – shallow trench isolation –...
Andrew B. Kahng, Puneet Sharma, Rasit Onur Topalog...