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» Co-design of interleaved memory systems
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ISCA
1996
IEEE
99views Hardware» more  ISCA 1996»
13 years 10 months ago
High-Bandwidth Address Translation for Multiple-Issue Processors
In an effort to push the envelope of system performance, microprocessor designs are continually exploiting higher levels of instruction-level parallelism, resulting in increasing ...
Todd M. Austin, Gurindar S. Sohi
ICFP
2008
ACM
14 years 5 months ago
Transactional events for ML
Transactional events (TE) are an approach to concurrent programming that enriches the first-class synchronous message-passing of Concurrent ML (CML) with a combinator that allows ...
Laura Effinger-Dean, Matthew Kehrt, Dan Grossman
ACSD
2003
IEEE
103views Hardware» more  ACSD 2003»
13 years 11 months ago
Design Validation of ZCSP with SPIN
— We consider the problem of specifying a model of the Zero Copy Secured Protocol for the purpose of LTL verification with the SPIN Model Checker. ZCSP is based on Direct Memory...
Vincent Beaudenon, Emmanuelle Encrenaz, Jean Lou D...
HPDC
2012
IEEE
11 years 8 months ago
Dynamic adaptive virtual core mapping to improve power, energy, and performance in multi-socket multicores
Consider a multithreaded parallel application running inside a multicore virtual machine context that is itself hosted on a multi-socket multicore physical machine. How should the...
Chang Bae, Lei Xia, Peter A. Dinda, John R. Lange
ASPLOS
2010
ACM
13 years 9 months ago
Micro-pages: increasing DRAM efficiency with locality-aware data placement
Power consumption and DRAM latencies are serious concerns in modern chip-multiprocessor (CMP or multi-core) based compute systems. The management of the DRAM row buffer can signif...
Kshitij Sudan, Niladrish Chatterjee, David Nellans...