11 search results - page 1 / 3 » Compact thermal modeling for temperature-aware design |
TC
2008
13 years 4 months ago
2008
Abstract-- Preventing silicon chips from negative, even disastrous thermal hazards has become increasingly challenging these days; considering thermal effects early in the design c...
ISCA
2003
IEEE
13 years 9 months ago
2003
IEEE
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
ICCAD
2007
IEEE
14 years 1 months ago
2007
IEEE
This paper studies microprocessor floorplanning considering thermal and throughput optimization. We first develop a stochastic heat diffusion model taking into account the appl...
DAC
2004
ACM
14 years 5 months ago
2004
ACM
Thermal design in sub-100nm technologies is one of the major challenges to the CAD community. In this paper, we first introduce the idea of temperature-aware design. We then propo...
ASPDAC
2006
ACM
13 years 10 months ago
2006
ACM
: With technology scaling, elevated temperatures caused by increased power density create a critical bottleneck modulating the circuit operation. With the advent of FinFET technolo...