11 search results - page 2 / 3 » Compact thermal modeling for temperature-aware design |
IPPS
2010
IEEE
13 years 2 months ago
2010
IEEE
Thermal management is critical for clusters because of the increasing power consumption of modern processors, compact server architectures and growing server density in data center...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
DAC
2008
ACM
13 years 6 months ago
2008
ACM
level of accuracy in IC package abstraction (compact models) to ensure robust thermal design. An overarching goal must be to reduce power consumption per function through smart pro...
ISPD
2003
ACM
13 years 9 months ago
2003
ACM
The thermal problem has been emerged as one of the key issues for next-generation IC design. In this paper, we propose a scheme to achieve better thermal distribution for partitio...
MSO
2003
13 years 5 months ago
2003
The Tracker is one of the CMS (Compact Muon Solenoid experiment) detectors to be installed at the LHC (Large Hadron Collider) accelerator, scheduled to start data taking in 2007. ...