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» Cost-driven 3D integration with interconnect layers
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DATE
2009
IEEE
183views Hardware» more  DATE 2009»
9 years 6 months ago
SunFloor 3D: A tool for Networks On Chip topology synthesis for 3D systems on chips
Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on C...
Ciprian Seiculescu, Srinivasan Murali, Luca Benini...
DATE
2009
IEEE
150views Hardware» more  DATE 2009»
9 years 6 months ago
A software-supported methodology for exploring interconnection architectures targeting 3-D FPGAs
—Interconnect structures significantly contribute to the delay, power consumption, and silicon area of modern reconfigurable architectures. The demand for higher clock frequencie...
Kostas Siozios, Vasilis F. Pavlidis, Dimitrios Sou...
ICCD
2004
IEEE
119views Hardware» more  ICCD 2004»
9 years 8 months ago
Simultaneous Scheduling, Binding and Layer Assignment for Synthesis of Vertically Integrated 3D Systems
Three dimensional vertically integrated systems allow active devices to be placed on multiple device layers. In recent years, a number of research efforts have addressed physical ...
Madhubanti Mukherjee, Ranga Vemuri
DAC
2010
ACM
9 years 3 months ago
Cost-driven 3D integration with interconnect layers
The ever increasing die area of Chip Multiprocessors (CMPs) affects manufacturing yield, resulting in higher manufacture cost. Meanwhile, network-on-chip (NoC) has emerged as a p...
Xiaoxia Wu, Guangyu Sun, Xiangyu Dong, Reetuparna ...
MICRO
2008
IEEE
208views Hardware» more  MICRO 2008»
9 years 6 months ago
Microarchitecture soft error vulnerability characterization and mitigation under 3D integration technology
— As semiconductor processing techniques continue to scale down, transient faults, also known as soft errors, are increasingly becoming a reliability threat to high-performance m...
Wangyuan Zhang, Tao Li
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