22 search results - page 1 / 5 » Cost-driven 3D integration with interconnect layers |
TCAD
2010
12 years 11 months ago
2010
Three-dimensional integrated circuits (3D-ICs) are a promising approach to address the integration challenges faced by current systems on chips (SoCs). Designing an efficient netwo...
ASPDAC
2011
ACM
12 years 8 months ago
2011
ACM
Abstract— Three-dimensional (3D) integration and Networkon-Chip (NoC) are both proposed to tackle the on-chip interconnect scaling problems, and extensive research efforts have b...
ASPDAC
2011
ACM
12 years 8 months ago
2011
ACM
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequent...
ICCD
2004
IEEE
14 years 1 months ago
2004
IEEE
Three dimensional vertically integrated systems allow active devices to be placed on multiple device layers. In recent years, a number of research efforts have addressed physical ...
DAC
2010
ACM
13 years 8 months ago
2010
ACM
The ever increasing die area of Chip Multiprocessors (CMPs) affects manufacturing yield, resulting in higher manufacture cost. Meanwhile, network-on-chip (NoC) has emerged as a p...