22 search results - page 5 / 5 » Cost-driven 3D integration with interconnect layers |
DATE
2010
IEEE
13 years 9 months ago
2010
IEEE
—3D integration is a key solution to the predicted performance increase of future electronic systems. It offers extreme miniaturization and fabrication of More than Moore product...
ASAP
2011
IEEE
12 years 4 months ago
2011
IEEE
—The domain of vision and navigation often includes applications for feature tracking as well as simultaneous localization and mapping (SLAM). As these problems require computati...