2 search results - page 1 / 1 » Damage mechanics modeling of concurrent thermal and vibratio... |
SCSC
2007
13 years 6 months ago
2007
— The problem of concurrent thermal and vibration loading has not been thoroughly studied even though it is common in electronic packaging applications. Here we attempt to addres...
MR
2007
13 years 4 months ago
2007
Damage pre-cursors based health management and prognostication methodology has been presented for electronic systems in harsh environments. The framework has been developed based ...