3 search results - page 1 / 1 » Determining an appropriate number of FOUPs in semiconductor ... |
WSC
2008
13 years 7 months ago
2008
In this paper, multiple orders per job type formation and release strategies are described for semiconductor wafer fabrication facilities (wafer fabs). Different orders are groupe...
WSC
2004
13 years 6 months ago
2004
Wafers in a 300-mm semiconductor fabrication facility are transported throughout the factory in carriers called front opening unified pods (FOUPs). Two standard capacities of FOUP...
EOR
2007
13 years 4 months ago
2007
: New semiconductor wafer fabrication facilities use Front Opening Unified Pods (FOUPs) as a common unit of wafer transfer. Since the number of pods is limited due to high costs, a...