7 search results - page 2 / 2 » DiCER: distributed and cost-effective redundancy for variati... |
HPCA
2011
IEEE
12 years 9 months ago
2011
IEEE
Extreme technology integration in the sub-micron regime comes with a rapid rise in heat dissipation and power density for modern processors. Dynamic voltage scaling is a widely us...
HPCA
2006
IEEE
14 years 5 months ago
2006
IEEE
As silicon technologies move into the nanometer regime, transistor reliability is expected to wane as devices become subject to extreme process variation, particle-induced transie...