—Increasing power density causes die overheating due to limited cooling capacity of the package. Conventional thermal management techniques e.g. logic shutdown, clock gating, fre...
With new technologies, temperature has become a major issue to be considered at system level design. Without taking temperature aspects into consideration, no approach to energy o...
A methodology for supporting dynamic voltage scaling (DVS) on commercial FPGAs is described. A logic delay measurement circuit (LDMC) is used to determine the speed of an inverter...
C. T. Chow, L. S. M. Tsui, Philip Heng Wai Leong, ...
—Parallel structures may be used to increase a system processing speed in case of large amount of data or highly complex calculations. Dynamic Voltage and Frequency Scaling (DVFS...