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DATE
2009
IEEE
138views Hardware» more  DATE 2009»
13 years 11 months ago
Hardware/software co-design architecture for thermal management of chip multiprocessors
—The sustained push for performance, transistor count, and instruction level parallelism has reached a point where chip level power density issues are at the forefront of design ...
Omer Khan, Sandip Kundu
DAC
2006
ACM
13 years 10 months ago
Signature-based workload estimation for mobile 3D graphics
Until recently, most 3D graphics applications had been regarded as too computationally intensive for devices other than desktop computers and gaming consoles. This notion is rapid...
Bren Mochocki, Kanishka Lahiri, Srihari Cadambi, X...