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» Electrical modeling and characterization of 3-D vias
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ICCAD
2001
IEEE
113views Hardware» more  ICCAD 2001»
14 years 2 months ago
Compact Modeling and SPICE-Based Simulation for Electrothermal Analysis of Multilevel ULSI Interconnects
This paper presents both compact analytical models and fast SPICE based 3-D electro-thermal simulation methodology to characterize thermal effects due to Joule heating in high per...
TingYen Chiang, Kaustav Banerjee, Krishna Saraswat
ISBI
2006
IEEE
14 years 6 months ago
A statistical appearance model based on intensity quantile histograms
We present a novel histogram method for statistically characterizing the appearance of deformable models. In deformable model segmentation, appearance models measure the likelihoo...
Robert E. Broadhurst, Joshua Stough, Stephen M. Pi...
ECCV
2006
Springer
14 years 7 months ago
An Integral Solution to Surface Evolution PDEs Via Geo-cuts
We introduce a new approach to modelling gradient flows of contours and surfaces. While standard variational methods (e.g. level sets) compute local interface motion in a different...
Yuri Boykov, Vladimir Kolmogorov, Daniel Cremers, ...
ASAP
2011
IEEE
233views Hardware» more  ASAP 2011»
12 years 5 months ago
Accelerating vision and navigation applications on a customizable platform
—The domain of vision and navigation often includes applications for feature tracking as well as simultaneous localization and mapping (SLAM). As these problems require computati...
Jason Cong, Beayna Grigorian, Glenn Reinman, Marco...