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ISCA
2005
IEEE
105views Hardware» more  ISCA 2005»
13 years 10 months ago
Exploiting Structural Duplication for Lifetime Reliability Enhancement
Increased power densities (and resultant temperatures) and other effects of device scaling are predicted to cause significant lifetime reliability problems in the near future. In...
Jayanth Srinivasan, Sarita V. Adve, Pradip Bose, J...
HIPEAC
2010
Springer
14 years 1 months ago
Maestro: Orchestrating Lifetime Reliability in Chip Multiprocessors
As CMOS feature sizes venture deep into the nanometer regime, wearout mechanisms including negative-bias temperature instability and timedependent dielectric breakdown can severely...
Shuguang Feng, Shantanu Gupta, Amin Ansari, Scott ...
DSN
2009
IEEE
13 years 8 months ago
Processor reliability enhancement through compiler-directed register file peak temperature reduction
Each semiconductor technology generation brings us closer to the imminent processor architecture heat wall, with all its associated adverse effects on system performance and reliab...
Chengmo Yang, Alex Orailoglu
INFOCOM
2005
IEEE
13 years 10 months ago
Exploiting heterogeneity in sensor networks
—The presence of heterogeneous nodes (i.e., nodes with an enhanced energy capacity or communication capability) in a sensor network is known to increase network reliability and l...
Mark D. Yarvis, Nandakishore Kushalnagar, Harkirat...
DAC
2008
ACM
13 years 6 months ago
IntellBatt: towards smarter battery design
Battery lifetime and safety are primary concerns in the design of battery operated systems. Lifetime management is typically supervised by the system via battery-aware task schedu...
Suman Kalyan Mandal, Praveen Bhojwani, Saraju P. M...