4 search results - page 1 / 1 » Exploring Carbon Nanotube Bundle Global Interconnects for Ch... |
VLSID
2009
IEEE
14 years 5 months ago
2009
IEEE
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck in ultra-deep submicron (UDSM) technologies. C...
ASPDAC
2007
ACM
13 years 8 months ago
2007
ACM
Single-walled carbon nanotube (SWCNT) bundles have the potential to provide an attractive solution for the resistivity and electromigration problems faced by traditional copper int...
ICCAD
2005
IEEE
14 years 1 months ago
2005
IEEE
The work in this paper analyses the applicability of carbon nanotube (CNT) bundles as interconnects for VLSI circuits, while taking into account the practical limitations in this ...
DATE
2007
IEEE
13 years 11 months ago
2007
IEEE
Field Programmable Gate Arrays (FPGAs) are important hardware platforms in various applications due to increasing design complexity and mask costs. However, as CMOS process techno...